Discover collaborative BIM for infrastructure – INTERGEO Berlin (Sep 26-28)

Come and meet our team at the upcoming INTERGEO (Berlin, Sep 26-28), the world’s leading conference trade fair for geodesy, geo information and land management. You'll find us in Hall 2.1 at Booth A2.008.

Together with Topcon we’ll be demonstrating how adapting to new ways of working and taking an integrated approach to hardware and software can deliver increased efficiency on infra construction projects, while improving the way data is collected, managed and shared.

To book a meeting with our experts, email to info(at)viasys.com

See below the schedule of our presentations:

Tuesday, Sep 26

14:30 – 15.30 Meet at Topcon Infodesk on Booth
Meet the experts on BIM: A collaborative solution for all – Buildings, Infrastructure, City Models

Wednesday, Sep 27

15:30 – 16.30 Meet at Topcon Infodesk on Booth
Meet the experts on BIM: A collaborative solution for all – Buildings, Infrastructure, City Models

Thursday, Sep 28

14:00 – 15.00 Meet at Topcon Infodesk on Booth
Viasys VDC & Topcon @ Intergeo: 4D- und 5D-BIM für alle – Bauwerke, Infrastruktur, Stadtmodelle

15:30 – 16:30 Meet at Topcon Infodesk on Booth
Meet the experts on BIM: A collaborative solution for all – Buildings, Infrastructure, City Models

Book your seat – Register in advance

Contact us

Our team at Viasys VDC is dedicated to helping you increase the efficiency of your civil engineering projects.